Recently, a remarkable breakthrough in two-dimensional semiconductor device integration technology was made by Associate Professor Ma Zichao and Professor Zhou Changjian, both from the School of Microelectronics at South China University of Technology. Their collaborative efforts with Professor Mansun Chan of the Hong Kong University of Science and Technology yielded significant results. The research findings, titled "Multiscale van der Waals Metallization via Peel-Front Strain Engineering," were published in the prestigious international journal Nano Letters and were chosen as the cover article for that particular issue, reflecting the high regard and impact of their work within the scientific community.
