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Intel's 2045 3D Chip Design Unveiled! Senior Executives Caution Against Ambitious 10-Fold Surge in Advanced Wafer Production
1 day ago /
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Author：小编
Intel's Chief Technology Officer, Pushkar Ranade, has expressed that, considering the present scale of global semiconductor manufacturing equipment, achieving a tenfold expansion in the production of advanced-process wafers is no small feat. A more pragmatic projection would be a twofold increase. Intel's 14A technology has been in the development phase for over three years, integrating cutting-edge technologies such as High-NA EUV (Extreme Ultraviolet) lithography, backside power delivery networks, CFET (Complementary FET), and hybrid bonding techniques.
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