BIWIN declared in a statement that the company is ramping up its dual-pronged strategy of 'storage plus wafer-level advanced packaging and testing' and expediting the establishment of a wafer-level advanced packaging and testing manufacturing project. Focusing on domains such as cutting-edge storage, integrated storage-computing packaging, and high-speed optoelectronic interconnects, the company is persistently propelling the research and development, along with the industrial application, of advanced packaging technologies such as FOMS, CMC, and OEC. It is actively delving into nascent markets like AI computing infrastructure, infusing fresh impetus into the company's medium- to long-term development trajectory. The company maintains an optimistic outlook on the medium- to long-term storage market opportunities ushered in by the AI industry. Leveraging its technological prowess and industrial synergies in spheres like storage solutions, chip design, and advanced packaging and testing, it is poised to actively capitalize on industry development prospects.