Samsung Electro-Mechanics Lands Another Major Corporate Deal, Boosting Semiconductor Package Substrate Operations
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Author:小编   

On October 19, Yonhap News Agency disclosed that Samsung Electro-Mechanics revealed on the same day that it had inked a long-term supply agreement, valued at roughly KRW 360.5 billion, for "memory semiconductor package substrates" with a prominent global company. As a result, the aggregate worth of long-term supply contracts secured by Samsung Electro-Mechanics over the past five months has surpassed KRW 4 trillion. Package substrates serve as crucial elements that link semiconductor chips to primary substrates, facilitating the transfer of electrical signals. High-performance semiconductors impose stringent demands on these substrates, requiring them to support high-speed signal transmission, high integration levels, and precise circuit fabrication. This contract marks a notable milestone for Samsung Electro-Mechanics in the components business arena, as, alongside its multi-layer ceramic capacitors and silicon capacitors, its package solutions division has also garnered a substantial volume of orders.