On October 18, Seoul Economic Daily reported that Samsung Electronics is set to adopt TSMC’s 3nm process technology to manufacture base wafers for Nvidia’s upcoming custom HBM chips. This move signifies Samsung’s inaugural collaboration with TSMC in the HBM production phase. According to the report, Nvidia has approached Samsung, SK Hynix, and Micron Technology, asking them to produce NVHBM base wafers using TSMC’s advanced process, while utilizing sixth-generation DRAM technology for the core chips. Launched in August of this year, the NVHBM integrates Nvidia’s custom memory controller into the base wafer, aiming to establish a standardized approach across various memory suppliers. Following internal evaluations, Samsung agreed to Nvidia’s proposal. However, the company intends to maintain its independent production of standard HBM and custom products for other clients. Moreover, Samsung is also assessing the feasibility of using its in-house foundry to produce NVHBM base wafers in the event that demand surpasses TSMC’s production capacity.