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On October 15, 2026, NAURA disclosed that its wholly-owned entity, Beijing NAURA Microelectronics Equipment Co., Ltd., intends to buy out the entire equity stake—that is 100%—of Beijing Nuohejianwei Equipment Co., Ltd. This stake is currently held by the Beijing Integrated Circuit Equipment Industry Investment and M&A Fund Phase II, and the transaction will be completed with a cash payment of 405 million RMB. Nuohejianwei is a company dedicated to the research and development, manufacturing, sales, and after-sales service of hybrid bonding equipment. Through this acquisition, NAURA aims to capitalize on synergistic benefits and bolster its competitive edge in the market for hybrid bonding equipment, as well as in the comprehensive platform for three-dimensional integration equipment.
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