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Owing to challenges related to the yield rate and necessary design refinements in the EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging substrate, the development timeline for Google's next-generation TPU v9's Core A has encountered a delay of roughly three weeks. This setback necessitates corresponding adjustments to the Core B and I/O (Input/Output) components, which are being managed by MediaTek. The relevant chips are projected to complete the tape-out process in January 2027 and commence mass production in the second quarter of the same year. Consequently, the initial batch of shipments might be rescheduled to the first quarter of 2028. While this development will exert short-term pressure on MediaTek, Marvell's medium-to-long-term standing within Google's ASIC (Application-Specific Integrated Circuit) supply chain is anticipated to remain robust.
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