Search
On October 13, Huawei convened the 2026 Kirin Media Communication Meeting at Lianqiu Lake in Shanghai. Xu Songyu, the director of the Wireless Terminal Chip Product Management Department within Huawei's Semiconductor Business Group, disclosed that the design of the next-generation Kirin chip, slated for 2027, has been finalized and has now entered the testing phase, with all test outcomes surpassing expectations. During the event, Xu Songyu, for the first time, presented the intricate architecture diagram of the Kirin 9050 Pro chip. This cutting-edge chip leverages logical folding technology to comprehensively enhance nine core components, including the new-generation Lingxi CPU and Maliang GPU. Furthermore, he announced that the next-generation Kirin chip for 2027 is fully prepared, with test results consistently meeting or exceeding expectations.
-
C114 Communication Network -
Communication Home
