The sampling phase of Intel’s next-generation Nova Lake processor has recently come to light, revealing that certain high-end models with specialized packaging are being kept under strict surveillance, thus preventing detailed specifications from being disclosed. Insider Jaykihn reports that early development samples of models designated as DS variants are being distributed in limited quantities. The "DS" acronym denotes Dual Compute Modules, indicating that two computing core modules are combined into a single CPU, typically signifying high-performance flagship offerings. When these DS chips are eventually commercialized, they will be marketed under the BFC brand. This can be likened to a large-cache variant optimized for gaming and demanding workloads, incorporating an integrated bLLC (big Last Level Cache). The underlying design rationale mirrors that of a competitor’s 3D V-Cache technology, with the goal of minimizing memory access latency.

Currently, no actual BFC chips have surfaced in the market, thanks to stringent confidentiality protocols akin to those employed by AMD. Although the BFC models are included in the initial product lineup, the broad-scale distribution of QS (Qualification Sample) versions is slated for December 2026. The most potent variant remains confined to the laboratory setting.