The Phase II project of the advanced packaging pilot platform at Hubei Xingchen Technology Co., Ltd. has officially been put into operation, heralding the first-ever domestic 3D advanced packaging mass production line. The combined investment in Phases I and II of the advanced packaging comprehensive experimental platform exceeds 7 billion yuan. Construction for Phase II got underway in October 2025. Once it reaches full operational capacity, the production line will be capable of simultaneously facilitating the pilot production and risk-based mass production of 40 to 50 chip models. Additionally, it will support the performance verification of 30 to 40 sets of domestically produced semiconductor equipment and materials.
