Based on the most recent report from Bernstein, a prominent U.S. investment research firm, Huawei's Kirin 9050 Pro chip has significantly reduced the technological disparity with Apple's mobile chips. Previously, the gap stood at around four years with the prior generation, but it has now been narrowed down to approximately three years. This remarkable achievement is attributed to the chip's production using SMIC's N+2 or N+3 process, which is on par with a 7nm level. Notably, this advancement was accomplished without the use of EUV lithography. Instead, the chip leverages DUV multi-patterning and logic folding technology to enhance its performance. The Kirin 9050 Pro features a logic folding architecture, which strategically arranges logic units in layers, resulting in a dual boost in both performance and energy efficiency. Compared to its predecessor, the transistor density of this chip has surged by 55%, leading to an overall device performance improvement of 42%.