At the Snapdragon Summit 2026, Qualcomm announced that its sixth-generation Snapdragon 8 Ultra Supreme Edition chip will adopt an innovative offset stacked packaging solution. Unlike traditional PoP packaging, this solution physically offsets the DRAM memory, so it no longer completely covers the SoC, allowing high-heat-generating computing core areas such as the CPU and GPU to have more direct contact with external thermal materials, thereby improving heat dissipation efficiency. The chip's clock speed exceeds 5.0GHz for the first time. Although it sacrifices a small amount of packaging space symmetry, it significantly enhances thermal performance, making it more suitable for flagship devices that demand extreme performance. It enables smartphones to maintain high frame rates or high throughput for longer periods in high-load scenarios, such as gaming, AI inference, and video rendering, reducing performance degradation.