At the grand opening ceremony of IPC2026 on September 22, 2026, BOE's Chairman, Chen Yanshun, announced that the company is on the verge of investing in a mass production line for semiconductor glass substrate carriers. This move comes after three years of dedicated research and development in this cutting-edge technology. Presently, BOE is collaborating closely with customers to co-develop related products.

Chen Yanshun further revealed that BOE's commitment to innovation is unwavering, with R&D investment set to surpass 80 billion yuan over the next five years. Within the coming year, the company will also outline its investment strategies for the mass production lines of glass-based perovskite devices and glass-based packaging carriers. Notably, BOE has already established a pilot line for glass-based perovskite devices, which has successfully achieved shipments across multiple scenarios. Meanwhile, the production process for glass-based packaging carriers has been finalized, and the products are currently undergoing joint development.