On September 22, BIWIN made an announcement revealing that the company, along with its majority-owned subsidiary, Guangdong Xinchenghanqi Semiconductor Technology Co., Ltd., is set to ink the 'Phase III Cooperation Agreement for the Wafer-Level Advanced Packaging and Testing Manufacturing Project' with the Management Committee of the Dongguan Songshan Lake High-Tech Industrial Development Zone. The overall projected investment for Phase III of this project hovers around 4.5 billion yuan, with a substantial 4 billion yuan earmarked for fixed asset investments, encompassing construction of buildings, procurement of equipment, and more. The actual investments will be rolled out in phases, closely aligned with the project's advancement and grounded in real-time investment figures. Guangdong Xinchenghanqi has already demonstrated proficiency in a range of cutting-edge packaging technologies, such as 2.5D, RDL, Fan-in, and Fan-out. This Phase III endeavor signifies an expansion and capital augmentation of the existing project, with the construction slated to take place within the confines of the original project's industrial land, thereby negating the necessity for acquiring additional land.