On September 22, at the semi-annual performance review meeting, Liu Yan, the Board Secretary of Maxic Semiconductor, revealed that the company's diverse range of intelligent sensing sensor chips and power management chips form the backbone of AI smart glasses solutions. These chips are integral to features such as optical dials, wear detection, intelligent imaging, eye-tracking technology, and wireless charging capabilities. Maxic Semiconductor has initiated a series of phased, rational price adjustments for specific products, while proactively safeguarding its production capacity. By harnessing its in-house process development expertise, the company is partnering with upstream manufacturers on joint process R&D endeavors aimed at enhancing yield rates and boosting production efficiency. Looking ahead to the latter half of the year, Maxic Semiconductor remains committed to scaling up its production capacity to guarantee timely product deliveries.