In recent months, a number of traditional superhard material companies listed on the stock market have frequently issued announcements regarding changes in their investment and fundraising plans, all signaling their foray into the diamond heat dissipation sector. Some of these companies have already advanced to the stage of delivering samples and supplying products in small batches for their relevant offerings. Currently, the iterative development of AI large models has resulted in heightened power consumption in server chips. Traditional copper and aluminum heat dissipation materials are now pushing against their physical performance boundaries. In this context, CVD diamond heat sinks have emerged as the linchpin for addressing the heat dissipation challenges faced by high-power chips. Amid a sluggish market for both cultivated and industrial diamonds, coupled with mounting profit pressures, companies in the superhard material industry are opting to pivot towards semiconductor functional materials.