Search
On September 15, 2026, MediaTek orchestrated the Dimensity Flagship New Product Launch Event in Shenzhen, where it formally introduced the Dimensity 9600 Pro, a flagship 5G chip enhanced with AI capabilities. Leveraging TSMC's cutting-edge 2nm manufacturing process, this chip packs a staggering 33 billion transistors. It not only achieves a 14% performance boost compared to its forerunner but also slashes power consumption by 23%. Additionally, it is compatible with LPDDR6 memory and UFS 5.0 flash storage. The vivo X500 Pro series will take the lead globally in incorporating this advanced chip, closely followed by the OPPO Find X10 Pro Max as one of the early adopters. Xiaomi's Lu Weibing, Honor's Fang Fei, and Transsion's Wang Haibin conveyed their congratulations through video messages on the chip's release, although no particular model collaborations were disclosed.
-
C114 Communication Network -
Communication Home
