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On September 14, drawing on information from the supply chain, Taiwanese media outlets reported that TSMC had, for the first time, unveiled its capacity expansion goals for 2-nanometer and 3-nanometer chips for the upcoming year. Specifically, the production capacity for 2-nanometer chips is set to surge from 90,000 wafers at the close of this year to 110,000 wafers by mid-next year, reflecting a notable 22% increase. Similarly, the production capacity for 3-nanometer chips is projected to climb from over 180,000 wafers at the end of this year to 210,000 wafers by mid-next year, indicating an increase exceeding 16%. In response to these reports on September 13, TSMC clarified that it refrains from commenting on market rumors and that any explanations regarding capacity will be provided through official company announcements.
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