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On September 11, Changhong Technology revealed on an interactive platform that, in August 2026, the company successfully obtained a monthly procurement order for Front Opening Unified Pod (FOUP) products from a new customer at a domestic memory wafer factory. Moreover, it has kept receiving orders from new customers since September. At present, its semiconductor wafer carrier products have secured orders from several wafer factories. The company is also making progress in customer validation and market expansion for products including FOUPs, Front Opening Shipping Boxes (FOSBs), photomask carriers, and ultra-clean containers. However, the company cautions that product introduction and order acquisition are subject to uncertainties. These uncertainties are influenced by factors such as customer validation cycles, capacity building efforts, and market demand fluctuations.
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