The AST6200, a 350nm step-and-project photolithography machine independently developed by XS Micro, has successfully undergone full-process verification by leading domestic compound semiconductor enterprises and secured substantial repeat orders. This equipment boasts a stable 350nm resolution, compatibility with various substrate materials, and a fully stack-developed software control system, making it ideal for production lines, such as those for power devices. Remarkably, from the shipment of the first machine to the acquisition of bulk orders, it took only nine months. The AST6200 fills a critical gap in domestic mid-to-high-end photolithography equipment for third-generation semiconductor mass production lines, paving the way for domestic equipment to replace imported alternatives in niche markets. It is worth noting that this equipment adopts a step photolithography machine technology route, which fundamentally differs in principle and application scenarios from the step-and-scan photolithography machines used for silicon-based logic chips. XS Micro, a spin-off from Shanghai Micro Electronics, specializes in the 'More than Moore' track, holding approximately 35% of the global market share and up to 90% of the domestic market share in the advanced packaging photolithography machine market.