On August 28, the National Development and Reform Commission (NDRC) highlighted four key achievements in China’s integrated circuit (IC) industry for the current year. First, significant progress has been made in core technologies. Notably, advancements in high-end chip design and manufacturing capabilities have been achieved, along with the establishment of differentiated advantages in specialized processes. Breakthroughs have also accelerated in areas such as advanced packaging and memory technologies. Second, enterprise competitiveness has seen marked improvement. Listed companies that have released their financial reports for the first half of the year reported a 12.8% year-on-year increase in revenue and a 99% year-on-year surge in net profit. Companies are actively engaged in research and development, with R&D investment rising by 13.4% year-on-year. Additionally, industry-wide investment and capacity expansion have picked up pace, with IC manufacturing investment increasing by 11.5% year-on-year over the first seven months. Third, capacity utilization remains robust. In the first half of the year, major domestic wafer foundry enterprises maintained capacity utilization rates exceeding 90%. Capacities across various processes have been gradually released to meet the manufacturing demands of diverse chip types, leading to strong production and sales performance. Fourth, the security and resilience of the industrial chain have been significantly enhanced.