On August 12th, a research report from the China International Capital Corporation (CICC) highlighted that China's Printed Circuit Board (PCB) industry has experienced rapid growth in recent years, presenting domestic enterprises with significant opportunities to venture into the dry film manufacturing sector. The production of dry film demands a high level of technical expertise, and given the steady rise in market demand, it holds substantial long-term investment prospects. Estimates suggest that the photosensitive dry film market is poised to reach USD 2.333 billion by 2026, with projections indicating a further increase to USD 3.348 billion by 2030, reflecting a Compound Annual Growth Rate (CAGR) of 9.44%. Data from Prismark indicates that the global PCB market is expected to hit USD 85.8 billion in 2025, marking a 16.7% year-on-year increase; it is anticipated to reach USD 102 billion this year, representing a 19% year-on-year surge; and by 2030, the market size is forecasted to expand to USD 144.6 billion. With the AI sector's swift advancement, the demand for high-end PCBs, including multilayer boards, High-Density Interconnect (HDI) boards, and packaging substrates, is skyrocketing. By 2030, it is estimated that the market size for dry films corresponding to these premium PCBs will witness a 45.2%, 50.6%, and 54.4% increase, respectively, compared to 2026 figures.