According to Nikkei, Sony Group and TSMC plan to start mass production of next-generation image sensor semiconductors in Kumamoto Prefecture, Japan, as early as 2029. The production will be handled by a joint venture between the two companies, with Sony holding approximately 60% and TSMC holding about 40%. The total investment in the project is expected to reach 1 trillion yen (approximately RMB 42.738 billion). In May this year, the two sides reached a basic agreement on the research, development, and production of next-generation image sensors. They are expected to reach an agreement on the mass production investment plan in the near future and establish a joint venture before the end of fiscal year 2026. The joint venture will provide high-performance camera sensors for products such as Apple iPhones and aims to enhance sensor performance to enable AI systems to identify objects more accurately, thereby venturing into the field of 'physical AI.' Currently, both parties are discussing the possibility of obtaining government subsidies with Japan's Ministry of Economy, Trade and Industry.