On August 3, reports emerged indicating that, propelled by the fervent demand for production capacity from clients including NVIDIA, AMD, and Broadcom, TSMC is now projected to achieve its initial objective of manufacturing 180,000 3nm wafers on a monthly basis earlier than planned. Originally slated for accomplishment by the year's end, this milestone is now anticipated to be met by the commencement of the fourth quarter. In tandem with this, the volume of orders for the 2nm process is also experiencing a swift uptick, with expectations that monthly wafer shipments will near the 100,000-unit mark by the close of the year.