Samsung to Launch HBM Expansion Project in Onyang, South Korea, in October for Production Start in 2029 - Chip

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Samsung to Launch HBM Expansion Project in Onyang, South Korea, in October for Production Start in 2029

1 day ago / Read about 0 minute

Author：小编

Samsung Electronics plans to launch an expansion project for its semiconductor packaging plant in Onyang, South Korea, in October 2026, with an investment of KRW 46 trillion (approximately RMB 210.588 billion), aiming to achieve mass production of high-bandwidth memory (HBM) by May 2029.

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