HKC Corporation announced that on July 17, 2026, it signed the with the Management Committee of the Shaoxing Area of the Hangzhou-Shaoxing Airport Economic Integration Development Demonstration Zone. The company plans to invest 4 billion yuan to establish a wholly-owned subsidiary, Zhejiang Huixin Advanced Semiconductor Co., Ltd., to undertake the HKC Advanced Packaging and Testing Project. The project will be constructed in two phases. Phase I involves the construction of a 12-inch hybrid chip advanced packaging and testing production line, with a monthly production capacity of 20 million units upon completion, and a construction period not exceeding three years.
