Goke Microelectronics: Plans to Secure Up to 5.061 Billion Yuan via Private Share Placement, Funding Projects in R&D and Commercialization of Next-Gen AI Visual Processing Chips and Solutions
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Author:小编   

On July 17, Goke Microelectronics made an announcement stating its intention to raise a maximum of 5.061 billion yuan through a private share placement targeted at specific investors. After accounting for issuance expenses, the proceeds will be predominantly allocated to R&D and commercialization initiatives for next-generation AI visual processing chips and solutions, media interaction AI chips, and edge-side AI chips. Additionally, a portion of the funds will be used to bolster working capital. The total number of shares to be issued will not exceed 65.1307 million, with a cap of 35 issuance targets. This move is designed to fuel the company's R&D endeavors, production capabilities, and market expansion for AI chips.