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TCL Zhonghuan: Its Subsidiary Intends to Pour 11.96 Billion Yuan into Shenzhen Integrated Circuit Large-Scale Semiconductor Silicon Wafer Project
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Author：小编
On July 17, TCL Zhonghuan made an announcement that its subsidiary, Zhonghuan Leading, has set its sights on investing a substantial 11.96 billion yuan in the Shenzhen Integrated Circuit Large-Scale Semiconductor Silicon Wafer Project. Shenzhen Zhonghuan Leading will serve as the primary implementing body for this endeavor. According to the plan, this project is designed to achieve a monthly production capacity of 700,000 units, encompassing 12-inch polished wafers, epitaxial wafers, and test wafers. The entire construction process is expected to span 60 months. In terms of funding, a multi-pronged approach will be adopted, involving self-raised funds, equity financing, and syndicated loans.
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