On July 15th, Anfu Technology made an announcement on an interactive platform, revealing that Suzhou Yilanwei has successfully engineered a single-wave 400Gbps optical chip. This cutting-edge chip is tailored for 3.2T data center optical modules and leverages silicon-photonic heterogeneous integration with thin-film lithium niobate technology. Its development is aimed at fulfilling the escalating need for high-speed optical interconnections in the future.
