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Changxin Bochuang: Glass Bridge is mainly used to solve the in-board/package-level optical connection between chips (PIC) and optical fibers
11 hour ago /
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Author：小编
On July 10, Changxin Bochuang disclosed on an interactive platform that Corning's GlassBridge technology primarily addresses in-board and package-level optical connection issues between chips and optical fibers, serving as a foundational technology in the upstream of the optical communication industry chain. This technology will promote the overall progress of optical interconnection technology, with each segment of the CPO industry chain holding unique value. Changxin Bochuang will continue to monitor technological developments and actively deploy related products.
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