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Reports say TSMC continues to enhance CoWoS manufacturing capacity: producing at least 200,000 wafers per month by 2027
1 day ago /
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Author：小编
TSMC is expanding its production capacity for CoWoS, a 2.5D advanced packaging technology, with plans to manufacture 200,000 wafers per month by 2027, and actual capacity is expected to reach 240,000 to 260,000 wafers. However, this capacity will still struggle to meet the demand for integrating logic chips with HBM in AI XPUs, prompting customers to seek alternative solutions. Additionally, TSMC is advancing its technological development, with plans to introduce CoWoS versions supporting 20 and 24 HBM stacks by 2028 and 2029, respectively, and is developing ultra-large-scale heterogeneous integration solutions such as SoW-X and CoPoS.
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