Based on the forecast report issued by SEAJ, the global equipment sales forecast for Japanese semiconductor equipment manufacturers in FY2026 has undergone an upward revision. This adjustment is driven by the investment surge in cutting-edge logic chips for AI servers and the significant ramp-up of investments in DRAM production lines, with a particular focus on HBM. Initially projected at 5,500.4 billion yen in January 2026, the forecast has now been elevated by roughly 20%, translating to an addition of 1,049.8 billion yen, bringing the updated forecast to 6,550.2 billion yen. In comparison to FY2025, this signifies a year-on-year surge of 26.0%, with annual sales poised to exceed 6 trillion yen for the inaugural time, heralding a third successive year of record-breaking achievements. SEAJ further noted that, owing to the persistent robust demand for AI server chips and the phased commencement of operations at numerous newly constructed wafer fabs, it has markedly increased its sales forecast for Japanese semiconductor equipment in FY2027, from the initial 5,610.4 billion yen to 7,401.7 billion yen. This reflects a year-on-year uptick of 13.0% and the potential to establish a new record for the fourth consecutive year.