TrendForce's latest MLCC industry research indicates that driven by the accelerated upgrade of AI servers and increased production of CSP's self-developed ASIC chips, by late June 2026, the BB Ratios of the three major industry leaders—Murata, Samsung Electro-Mechanics, and Taiyo Yuden—reached 1.3, 1.31, and 1.25, respectively, setting new highs. The overall BB Ratio of the MLCC market also rose to 1.04. In the second half of 2026, with the mass production of new AI chip platforms from companies such as NVIDIA, Google, and AMD commencing in the third quarter, production capacity will continue to be occupied by AI orders. Coupled with the demand for advanced stockpiling, it is expected that MLCC lead times will extend in the second half of the year, with prices for high-end MLCCs showing an upward trend. The fourth quarter will be a critical period to observe whether a formal shortage in the high-end MLCC market emerges.