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ASE Group Once Again Hikes Packaging Quotes, with Rises Exceeding 20%
2 hour ago /
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Author：小编
On July 1, ASE Group, the globe's preeminent supplier of semiconductor packaging and testing services, declared yet another round of increases in its packaging quotes, with some rises surpassing 20%. This latest price adjustment encompasses cutting-edge packaging technologies, including Chip-on-Wafer-on-Substrate (CoWoS) and Fan-Out Chip-on-Substrate (FoCoS), and also has an impact on its major U.S. clientele. Tien Wu, the CEO of ASE Group, explained that the primary drivers behind these price hikes are the escalating costs of raw materials and the heightened capital expenditures.
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