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ASE Increases Quotes for Advanced Packaging, with Maximum Increase of 20%
7 hour ago /
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Author：小编
ASE, the global leader in outsourced semiconductor assembly and test (OSAT), has once again raised its packaging quotes, with a maximum increase exceeding 20%. This price adjustment involves advanced packaging technologies such as wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP), affecting its major U.S. customers as well. ASE's CEO Tien Wu stated that the price hikes are primarily driven by rising raw material costs and increased capital expenditures, making the adjustment necessary.
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