On June 27, Durga Malladi, Executive Vice President of Qualcomm, revealed that the company plans to apply the newly announced data center chip technology this week to smartphones to enhance the local AI computing capabilities of mobile devices. Qualcomm's newly launched High Bandwidth Computing (HBC) architecture adopts a vertically stacked design, tightly integrating memory and computing units to significantly improve data transmission speed and efficiency. The first-generation product of this architecture will make its debut in data centers next year, with commercial supply expected by 2028. Malladi stated that the company is in discussions with smartphone, personal computer, and automotive manufacturers regarding this technology.
