On June 25, TSMC hosted the '2026 China Technology Forum'—a closed-door event—at the Shanghai International Convention Center. During the forum, TSMC shared its latest advancements in technology R&D and provided valuable industry insights to its customers and partners. TSMC predicts that, propelled by the rapid expansion of AI, the global semiconductor market will exceed the $1 trillion mark this year and is projected to reach $1.5 trillion by 2030. Within this market, demand from the high-performance computing (HPC) and AI sectors is expected to constitute 55% of the total market, with smartphones contributing around 20%, and automotive and IoT sectors each accounting for roughly 10%.

TSMC also disclosed that, from 2026 to 2028, its N2/A16 advanced process capacity will experience a compound annual growth rate (CAGR) of 70%. Furthermore, from 2022 to 2027, the capacity of its mature and advanced N3 and N5 processes will increase by 25% annually. Notably, the first-year wafer output of N2 is anticipated to be 45% higher than that of N3 during the corresponding period. In addition, TSMC has outlined plans to achieve a CAGR exceeding 80% in its advanced packaging capacities for CoWoS and SoIC technologies from 2022 to 2027.