Search
Intel and UMC have announced a collaboration to jointly develop 12nm and 3nm chip manufacturing processes, with production to be concentrated at Intel's Fab 52 facility in Arizona. The 12nm process collaboration will be implemented first, with PDK expected to be delivered to customers this year, tape-out completed by early 2027, and full-scale production commencing by the end of the year, primarily targeting markets such as IoT and WiFi chips. The two sides also plan to develop a process node with performance comparable to TSMC's 3nm, with a similar agreement structure to the 12nm collaboration. UMC will leverage Intel's manufacturing capabilities to achieve technological upgrades, while Intel will enhance its capacity utilization through UMC's customer resources.
-
C114 Communication Network -
Communication Home
