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Jingtuo Co., Ltd.: Ultra-Large Reflow Soldering Machine Sent for Sample Evaluation
4 day ago /
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Author：小编
Recently, in a research interview, Jingtuo Co., Ltd. disclosed that its independently developed, ultra-large reflow soldering equipment, specifically tailored for integrated circuits, has undergone five rounds of iterative improvements. This advanced machine is now capable of tackling the intricate process challenges that arise during the PCBA soldering of cutting-edge packaging chips. Presently, the equipment has been dispatched to the customer's premises for prototype performance evaluation. It is designed to accommodate substrates measuring 500mm or larger and features top-tier thermal deformation control, setting a new benchmark in the industry.
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