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Recently, during a research interview, BOE A announced that the company has successfully integrated the full-process technology for glass substrate packaging carrier plates. This encompasses key steps such as the formation of Through-Glass Vias (TGV), deep via copper filling, the creation of build-up layers, and wiring. Additionally, BOE A has accomplished the development and sample delivery of large-sized, high-layer-count glass substrate carrier plates. Some of their customers have successfully passed the conceptual certification stage and are now entering the technical testing phase. However, it's important to note that mass production for this business segment has not yet commenced, and consequently, no revenue has been generated from mass production activities at this time.
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