Search
On June 18, 2026, SK Hynix made a significant announcement, revealing that it has commenced supplying samples of its latest-generation 12-layer stacked HBM4E high-bandwidth memory to key clients. This innovative product boasts an impressive maximum single-die capacity of 48GB and can achieve a data transfer rate of up to 16Gbps. Moreover, it showcases a remarkable improvement in energy efficiency, surpassing the previous generation by over 20%. Specifically tailored to cater to the escalating demands of the artificial intelligence chip market, this memory solution stands out. The remarkable capacity leap is made possible through a 12-layer stacking technique, which not only enhances performance but also streamlines the package's height and complexity, thereby offering greater flexibility in system design.
-
C114 Communication Network -
Communication Home
