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TrendForce: This Year Set to Be Pivotal Validation Phase for TSMC's CoPoS Equipment and Materials, Glass Substrates May Enter Mass Production Post-2030
7 hour ago /
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Author：小编
On June 17, TrendForce released its latest report, highlighting that TSMC is currently channeling significant efforts into CoPoS (a kind of advanced packaging technology) technology, with a specific focus on adopting a substrate size of 310×310 millimeters. According to the report, 2026 is poised to be a pivotal year for the validation of equipment and materials supplied by relevant vendors. Trial production is slated for 2027, with official mass production expected to commence in the latter half of 2028. Additionally, TSMC plans to prioritize the development of glass substrates in its next phase of innovation, with mass production potentially kicking off after 2030.
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