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TERA Laser: The company's TGV laser micro-hole equipment has achieved wafer-level and panel-level equipment delivery
6 day ago /
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Author：小编
TERA Laser stated on an interactive platform that its TGV laser micro-hole equipment, through precise control systems and laser modification technology, can perform micro-hole and micro-groove processing on glass substrates of different materials. It has achieved wafer-level and panel-level equipment delivery, comprehensively covering fields related to advanced semiconductor packaging and new display technologies.
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