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TSMC's CoWoS supply-demand gap is expected to narrow to 10% by the end of 2026
4 hour ago /
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Author：小编
TSMC and its partners are actively expanding their advanced packaging capacity. It is expected that by the end of 2026, the CoWoS supply-demand gap will significantly shrink from the current approximately 20% to around 10%, with further improvements anticipated in 2027. By then, TSMC's monthly CoWoS capacity is expected to reach 120,000 to 140,000 wafers. Combined with the additional 50,000 to 60,000 wafer capacity from OSAT partners, the industry's monthly capacity may approach 200,000 wafers.
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