Amid the global technology industry’s confrontation with “deglobalization” challenges, China’s semiconductor sector is exhibiting robust growth momentum. Deloitte China’s China Semiconductor Industry Development Report highlights that the industry is undergoing a pivotal shift—from isolated “point breakthroughs” to a coordinated “full-chain evolution.” Across segments such as chip design, advanced packaging, equipment and materials, and wafer fabrication, collaborative efforts are fostering a resilient industrial ecosystem. By 2026, China’s semiconductor sector is projected to achieve notable strides across multiple domains: In chip design, mainland Chinese firms are expected to capture 45% of the global market share, surpassing Taiwan (China) for the first time and securing the second-largest global position. Advanced packaging technologies, including Chiplet and 3D stacking, will see widespread adoption, boosting overall chip performance. The equipment and materials sector will witness a marked rise in localization rates, with stable mass production and supply of high-end photoresists and 12-inch silicon wafers. In wafer fabrication, the global share of mature process capacity will continue to climb, with localization rates for 28nm and above mature process chips nearing 45% and steadily progressing toward the annual target of 55%. Additionally, policy support, robust market demand, and accelerated import substitution are collectively propelling the high-quality development of China’s semiconductor industry.