MediaTek: Next-Generation Chip to Exclusively Adopt Intel's EMIB-T Packaging, with Mass Production Expected in Q4 2027 - Chip

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MediaTek: Next-Generation Chip to Exclusively Adopt Intel's EMIB-T Packaging, with Mass Production Expected in Q4 2027

2 week ago / Read about 0 minute

Author：小编

MediaTek announced that its next-generation chip will exclusively adopt Intel's EMIB-T advanced packaging technology, abandoning TSMC's CoWoS solution. The chip project is planned for tape-out in the fourth quarter of 2026, with mass production scheduled for the fourth quarter of 2027.

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