AAC Technologies' MEMS Piezoelectric Active Cooling Chip Set for Mass Production and Distribution
2 day ago / Read about 0 minute
Author:小编   

On May 29, AAC Technologies made a recent announcement stating that its CoolFan series of active cooling chips, which are built on pivotal MEMS piezoelectric thin-film technology, have successfully concluded research and development trials. These chips have now advanced to the small-scale trial production phase, with the anticipation of initiating mass production and distribution by early 2027. This innovative product is tailored to cater to the cooling needs of AI smartphones, smartwatches, XR glasses, as well as a diverse range of AI smart terminals, ensuring optimal performance and reliability in cutting-edge technology devices.