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Samsung Electronics: Initiates Delivery of 12-Layer HBM4E Chip Samples to Key International Clients
2 day ago /
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Author：小编
On May 29, Samsung Electronics revealed that it has started to dispatch the inaugural batch of 12-layer HBM4E chip samples to prominent global clients. These chips boast a substantial 48GB capacity, marking a significant surge of over 30% in comparison to its preceding generation.
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