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Huitian New Material: The adhesive for semiconductor packaging has been supplied, applied, or is undergoing promotional verification at industry clients
8 hour ago /
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Author：小编
On May 28, Huitian New Material stated on an interactive platform that the company's adhesive for semiconductor packaging has been supplied, applied, or is undergoing promotional verification at industry clients. The Guangzhou base is organizing production in an orderly manner according to customer orders and will focus on its core business and optimize its product structure in 2026.
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