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Zhengye Technology: At Present, No Equipment Available for Non-Destructive Internal Testing of Stacked Chip Packages
9 hour ago /
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Author：小编
Zhengye Technology announced on an interactive platform that, as of now, the company lacks equipment specifically designed for the non-destructive internal testing of stacked chip packages. The X-ray inspection equipment it manufactures is primarily utilized for the non-destructive detection of internal flaws in lithium batteries. Additionally, the company is proactively venturing into new sectors, including electronic manufacturing.
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